Arlon Electronic Materials
85N Polyimide
Pure Polyimide Laminate & Prepreg · IPC-4101/40 & /41
Lead-Free Compatible
RoHS / WEEE Compliant
Halogen-Free
IPC-4101/40 & /41
Extreme High-Temp
Arlon 85N is a pure polyimide laminate and prepreg offering the ultimate high-reliability solution. Its random-fiber organic reinforcement delivers outstanding dimensional stability and significantly less PTH failure, delamination, or board degradation compared with FR-4, high-performance epoxies, or other high-performance materials — making it the substrate of choice when boards will see sustained temperatures that destroy standard laminates.
Thermal Properties
| Glass Transition Temp (Tg) | 260°C (TMA/DSC) |
| Decomposition Temp (Td, 5% wt loss) | 407°C |
| Decomposition Temp (Td, initial) | 387°C |
| T-260 | >60 min |
| T-288 | >60 min |
| T-300 | >60 min |
| CTE (x, y axes) | 16 ppm/°C |
| CTE (z axis, below Tg) | 55 ppm/°C |
| CTE (z axis, above Tg) | 149 ppm/°C |
| Z-axis expansion (50–260°C) | 1.2% |
Electrical Properties
| Dielectric Constant @ 1 MHz | 4.2 |
| Dissipation Factor @ 1 MHz | 0.010 |
| Volume Resistivity (C-96/35/90) | 1.5 × 10⁸ MΩ·cm |
| Surface Resistivity (C-96/35/90) | 1.6 × 10⁹ MΩ |
| Electric Strength | 1,450 V/mil (57.1 kV/mm) |
| Arc Resistance | 143 sec |
Physical & Mechanical Properties
| Peel Strength (1 oz Cu) | 7.1 lb/in (1.2 N/mm) |
| Young's Modulus | 0.27 Mpsi |
| Water Absorption | 0.27% |
| Flammability | HB (UL-94) |
| Halogen-Free | Yes (non-MDA chemistry) |
| Lead-Free Processing | Compatible |
Availability
| Glass Styles | 106, 1080, 2313, 2116, 7628 |
| Resin Content Range | 40–72% |
| Cure time vs competition | Up to 50% reduction |
Typical Applications
- Aircraft engine instrumentation
- Downhole oil & gas drilling electronics
- On-engine control modules
- Burn-in board manufacturing
- Industrial sensors (high-temp environments)
- Aerospace avionics requiring >200°C operation
- SMT boards with tight CTE matching requirements
- High-reliability multilayer builds (>8 layers)
Isola Group
FR408HR
High-Performance FR-4 Laminate & Prepreg · UL E45456
Lead-Free Compatible
RoHS Compliant
IPC-4101B /21 /24 /98 /99 /101 /126
UL FR-4 E45456
Low Dk / Low Df
UV Blocking / AOI
Isola FR408HR is a proprietary 230°C (DMA) Tg FR-4 system delivering a 30% improvement in Z-axis expansion and 25% more electrical bandwidth (lower loss) than competitive products. It bridges the thermal and electrical performance gap — offering high-speed signal integrity alongside genuine lead-free reliability, with FR-4 familiarity in fabrication and processing. The system is laser fluorescing and UV-blocking for full AOI compatibility.
Thermal Properties
| Glass Transition Temp (Tg, DSC) | 200°C (spec min 170°C) |
| Glass Transition Temp (Tg, DMA) | 230°C |
| Decomposition Temp (Td, 5% wt loss) | 360°C |
| T-260 | >60 min |
| T-288 | 60 min |
| CTE z-axis (below Tg) | 55 ppm/°C |
| CTE z-axis (above Tg) | 230 ppm/°C |
| CTE x, y axes | 16 ppm/°C |
| Z-axis expansion (50–260°C) | 2.8% |
| Thermal Conductivity | 0.4 W/m·K |
Electrical Properties
| Dielectric Constant (Dk) @ 100 MHz | 3.72 |
| Dielectric Constant (Dk) @ 1 GHz | 3.69 |
| Dielectric Constant (Dk) @ 5 GHz | 3.64 |
| Dielectric Constant (Dk) @ 10 GHz | 3.65 |
| Loss Tangent (Df) @ 100 MHz | 0.0072 |
| Loss Tangent (Df) @ 1 GHz | 0.0091 |
| Loss Tangent (Df) @ 5 GHz | 0.0098 |
| Loss Tangent (Df) @ 10 GHz | 0.0095 |
| Volume Resistivity | 3.81 × 10⁸ MΩ·cm |
| Dielectric Breakdown | 70 kV |
Physical & Mechanical Properties
| Peel Strength (low-profile Cu foil) | 6.5 lb/in (1.14 N/mm) |
| Peel Strength (standard profile Cu) | 5.5 lb/in (0.96 N/mm) |
| Flexural Strength (lengthwise) | 67,000 lb/in² |
| Flexural Strength (crosswise) | 62,000 lb/in² |
| Water Absorption | 0.24% |
| Flammability | V-0 (UL-94) |
| Max Operating Temperature (DSR) | 130°C (150°C) |
Availability
| Thickness Range | 0.0025" [0.05mm] to 0.093" [2.4mm] |
| Copper Foil Cladding | Grade 3 (HTE), ½, 1, and 2 oz |
| Foil Options | Reverse treat available |
Typical Applications
- High-speed server & networking PCBs
- Backplane & midplane assemblies
- Telecom infrastructure switching equipment
- RF & microwave PCBs (to ~20 GHz)
- Automotive ADAS & radar module boards
- Industrial test & measurement equipment
- Medical imaging & diagnostic mainboards
- Lead-free multi-reflow assembly designs
ITEQ Corporation
IT-180ABS / IT-180ATC
High-Tg Low-CTE Multifunctional Epoxy · Phenolic-Curing
Lead-Free Compatible
Low CTE
High Tg (>170°C)
Phenolic-Cured
IPC-4101 Compliant
ITEQ IT-180A series are high-Tg, low-CTE multifunctional epoxy laminates cured with a phenolic hardener system — a chemistry class known for excellent thermal stability and decomposition resistance. The IT-180ABS designation covers base laminates; IT-180ATC is the copper-clad laminate specification. With Tg exceeding 170°C and a low Z-axis CTE, these boards are built for lead-free assembly with multiple reflow cycles and demanding industrial environments.
Thermal Properties
| Glass Transition Temp (Tg) | >170°C |
| CTE Classification | Low CTE |
| Lead-Free Process Compatible | Yes (260°C+ reflow capable) |
| Curing System | Phenolic (superior Td vs standard epoxy) |
Electrical Properties
| Dielectric Constant @ 1 MHz | <5.4 (spec max) |
| Volume Resistivity (C-96/35/90) | >10⁶ MΩ·cm |
| Volume Resistivity (after moisture) | >10⁴ MΩ·cm |
| Volume Resistivity (E-24/125) | >10³ MΩ·cm |
| Surface Resistivity (C-96/35/90) | >10⁴ MΩ |
| Surface Resistivity (after moisture) | >10³ MΩ |
| Surface Resistivity (E-24/125) | >10³ MΩ |
| Dielectric Breakdown | >40 kV |
Mechanical Properties
| Peel Strength ½oz Cu (<0.5mm board) | >4.0 lb/ft² |
| Peel Strength 1oz Cu (<0.5mm board) | >4.5 lb/ft² |
| Peel Strength 1oz Cu (≥0.5mm board) | >6.0 lb/ft² |
| Peel Strength 2oz Cu (≥0.5mm board) | >8.0 lb/ft² |
| Peel Strength 3–5oz Cu (≥0.5mm) | >9.0 lb/ft² |
| Moisture Absorption | <0.5% |
Typical Applications
- Consumer electronics motherboards
- Networking & telecom switching boards
- Industrial control system PCBs
- Automotive electronics (body & chassis)
- Multi-reflow lead-free assembly designs
- High layer-count multilayer boards
- Power supply and UPS mainboards
- Medical diagnostic equipment boards
Taiwan Union Technology Corporation
TU-768 / TU-768P
Lead-Free Compatible Hi-Tg Epoxy Laminate & Prepreg · UL E189572
Lead-Free Compatible
CAF Resistant
AOI / UV-Block
UL FR-4 · 94V-0
Hi-Tg Epoxy
TU-768 and TU-768P are high-quality woven E-glass laminates coated with an epoxy resin system engineered for UV-blocking and AOI process compatibility. The series provides excellent CTE control, superior chemical and thermal resistance, and outstanding CAF (conductive anodic filament) resistance — making these boards ideal for applications that demand long-term insulation integrity under humidity, severe thermal cycling, and heavy assembly workloads.
Thermal Properties
| Glass Transition Temp (Tg, DMA) | 190°C |
| Glass Transition Temp (Tg, DSC) | 180°C |
| Glass Transition Temp (Tg, TMA) | 170°C |
| Decomposition Temp (Td) | 350°C |
| CTE (x-axis) | 11–15 ppm/°C |
| CTE (y-axis) | 11–15 ppm/°C |
| CTE (z-axis) | 2.7% |
| Thermal Stress, Solder Float @ 288°C | >60 sec |
| T-260 | >60 min |
| T-288 | >15 min |
| Flammability | 94V-0 (UL-94) |
| Max Operating Temperature | 130°C |
Electrical Properties
| Dielectric Constant (Dk) @ 1 GHz | 4.3 |
| Dielectric Constant (Dk) @ 5 GHz | 4.3 |
| Dielectric Constant (Dk) @ 10 GHz | 4.3 |
| Loss Tangent (Df) @ 1 GHz | 0.019 |
| Loss Tangent (Df) @ 5 GHz | 0.021 |
| Loss Tangent (Df) @ 10 GHz | 0.023 |
| Volume Resistivity | >10¹⁰ MΩ·cm |
| Surface Resistivity | >10⁸ MΩ |
| Electric Strength | >40 kV/mm |
Process & Availability
| UL Designation | FR-4, File E189572 |
| CAF Resistance | Yes |
| UV-Blocking / AOI Compatible | Yes (fluorescence) |
| Moisture Resistance | Superior |
| Thickness Range | 0.002" [0.05mm] to 0.062" [1.58mm] |
| Copper Foil Cladding | ⅛oz to 12oz (HTE) |
| Glass Styles | 106, 1080, 2113, 2116, 1506, 7628 |
Typical Applications
- Industrial PLCs & control system boards
- Telecom infrastructure & base stations
- Automotive body control modules
- Server motherboards & networking switches
- Boards requiring severe thermal cycle resistance
- High-humidity or outdoor electronics enclosures
- LED driver & power supply circuits
- Multi-layer lead-free assembly builds
Taconic Advanced Dielectric Division
TLY-5
PTFE / Woven Glass High-Frequency Laminate · Millimeter-Wave
Lead-Free Compatible
Ultra-Low Loss (Df 0.0019 @ 10 GHz)
Stable Dk 2.2
5G / Millimeter-Wave
Lightweight
Taconic TLY-5 is a PTFE/woven glass laminate engineered specifically for high-frequency applications where signal integrity is paramount. Its ultra-low dissipation factor (Df ≈ 0.0019 at 10 GHz) minimizes signal loss at microwave and millimeter-wave frequencies. The dielectric constant (Dk ≈ 2.2) remains stable across a wide frequency range — critical for consistent performance in high-speed digital and RF circuits. Lightweight and processable on standard PCB equipment, TLY-5 offers a cost advantage over ceramic alternatives while maintaining exceptional RF performance.
Electrical Properties
| Dielectric Constant (Dk) | ≈ 2.2 (stable, wide frequency range) |
| Dissipation Factor (Df) @ 10 GHz | ≈ 0.0019 |
| Signal Loss at Microwave Freq. | Minimal — designed for RF |
| Suitable Frequency Range | ≥ 1 GHz through millimeter-wave |
| Thermal Coefficient of Dk | Very low (stable over temperature) |
Thermal Properties
| Base Material | PTFE (no traditional Tg) |
| Thermal Stability | Excellent across wide temperature range |
| Thermal Cycling Performance | Superior — maintains RF properties |
| Lead-Free Reflow Compatible | Yes |
Physical Properties
| Reinforcement | Woven E-glass |
| Moisture Absorption | Very low (excellent humidity resistance) |
| Weight | Lightweight vs ceramic RF alternatives |
| Manufacturing Compatibility | Standard PCB processes (with PTFE handling precautions) |
| Design Flexibility | Suitable for complex multilayer configurations |
Typical Applications
- 5G and 6G antenna systems
- Automotive radar (77 GHz ADAS)
- Aerospace and defense radar
- Satellite communications
- GPS receiver modules
- Telecom base station equipment
- High-frequency oscillators and amplifiers
- Millimeter-wave imaging systems
